Macro Finance
Banks Eye $21 Billion of Bonds for Broadcom Chip-Financing Deal
Bloomberg Markets·October 27, 2026·1 min read
Banks plan to sell up to $21 billion of high-grade bonds as early as next year as part of a $63 billion funding package Broadcom has assembled to finance chips for AI developer Anthropic. The bond sale would be one of the largest this year, supporting Broadcom's expansion into AI infrastructure.
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