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Macro Finance

CanSemi Tech Joins China Chip IPO Wave With $919 Million Deal

Bloomberg Markets·September 23, 2026·1 min read

Chinese chip foundry CanSemi Technology Inc. is seeking to raise about 6.16 billion yuan ($919 million) in an initial public offering on the Shenzhen stock exchange’s ChiNext board. The company joins a wave of semiconductor firms capitalizing on Beijing’s drive for tech self-reliance.

Read at Bloomberg Markets
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